ASSEMBLY AND WIRE-BONDING OF ELECTRONIC CIRCUITS USING LASER PRINTING PROCESSES



Ref.No: 68127100
Start date: 23.07.2018
End date: 27.09.2022
Approval date: 23.07.2018
Department: APPLIED MATHEMATICAL & PHYSICAL SCIENCES
Sector: PHYSICS
Financier: ΕΣΠΑ 2014-2020, UPETH/EUDE ETAK
Budget: 331.396,30 €
Public key: ΩΝ1246ΨΖΣ4-2Ρ3
Scientific Responsible: Prof. ZERGIOTI
Email: zergioti@central.ntua.gr
Description: THE PRESENT PROJECT AIMS AT THE DEVELOPMENT OF NEW PROCESSES FOR THE ASSEMBLY AND THE WIRE BONDING OF ELECTRONIC CIRCUITS WITH DIGITAL LASER PRINTING AND SINTERING TECHNOLOGY IN ORDER TO INTEGRATE THEM INTO INDUSTRIAL PROCESSES ....
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