PLATED COPPER INTERCONNECTED SYSTEMS FOR ADVANCED MICROELECTRONICS

Ref.No: 63130700
Start date: 01.12.1998
End date: 31.12.2000
Approval date: 12.04.2002
Department: CHEMICAL ENGINEERING
Sector: CHEMICAL SCIENCES
Financier: INTAS, E.C.
Budget: 2.000,00 €
Scientific Responsible: Prof. NIKOLAOS SPURELLIS
Email: nspyr@chemeng.ntua.gr
Description: THE MAIN GOAL OF THE PROJECT ARE TO INTEGRATE COPPER PLATED METALLIZATION IN INSULATING SYSTEMS BASED ON MATERIALS WITH LOW DIELECTRIC CONSTANTS,AND TO DEVELOP ARCHITECTURE FOR INTERCONNECTING SYSTEMS OF ULTRA-LARGE-SCALE INTEGRATION CIRCUITS.
Go to Top